The sensors are based one an advanced “bulk micro machined” MEMS technology. The three dimensional structure (3D MEMS) of these sensors comprise a pendulum made of mono crystalline silicon. The pendulum is hermetically enclosed between two silicon discs. From this construction results a long term stable, high resolution und shock resistant sensor. A gas damping prevents overshooting and interfering resonance oscillation. The movement of the pendulum is measured capacitive by an ASIC.